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The most Frequently asked questions about packaging available through
MOSIS.
MOSIS FAQs
IC Packaging
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1.0 How Do I Request These Packaging Options:
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1.1 Unpackaged parts
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1.2 Combination of packaged and unpackaged parts
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1.3 More parts than the minimum for that process
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1.4 Use of a customer-supplied bonding diagram
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1.5 Use of customer-supplied packages
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1.6 Special orientation of my circuit in the package
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1.7 Sealing of package lids
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1.8 Downbond to the package cavity
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1.9 Bonding only SOME of my pads
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1.10 MOSIS standard frames
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1.11 A specific or minimum die size
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2.0 Can I Order The Following From MOSIS?
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2.1 Assembly in ceramic packages
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2.2 Assembly in plastic packages
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2.3 Packages and lids (materials only)
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2.4 Assembly of parts not fabricated by MOSIS
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2.5 Printed circuit boards
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2.6 MCM devices
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2.7 Flip chip (bump) assembly
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2.8 Testing services
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3.0 How does MOSIS select a package for my parts?
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4.0 Can I tell MOSIS which package to use?
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5.0 Can I receive parts sooner if I don't have them packaged?
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6.0 Can I receive parts sooner if I pay more money?
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7.0 Can I save money by ordering unpackaged parts?
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8.0 What are TinyChips?
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9.0 Are there any packaging restrictions for TinyChips?
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10.0 What layout does MOSIS recommend for bonding pads?
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11.0 Does using a guard ring affect pad spacing?
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1.0 How Do I Request These Packaging Options:
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1.1 Unpackaged parts
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To request that NONE of your parts be packaged, include the
following parameter in your NEW_PROJECT or FABRICATE
request.
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PACKAGE: NONE
For more information, see:
Unpackaged Parts.
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1.2 Combination of packaged & unpackaged parts
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To request that only some of your parts be packaged, include
BOTH of the following parameters in your
NEW_PROJECT or FABRICATE
request.
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PACKAGE: ?
(where "?" is the quantity to package)
UNPACKAGED: ?
(where "?" is the quantity to leave unpackaged)
For more information, see:
Unpackaged Parts.
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1.3 More parts than the minimum quantity for that process
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If you wish to order more than the minimum quantity of parts listed on
the Prototype Lot
Quantities page, include the the following parameter in your
NEW_PROJECT or FABRICATION request
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QUANTITY: ?
(where "?" is TOTAL quantity of parts you are ordering)
Note that you must order at least the minumum quantity of parts noted
on the Prototype Lot
Quantities page. If you wish to order more than the minimum, you
must order a multiple of the lot quantity listed for that process, or
request a custom price
quote for quantities over 100.
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1.4 Use of a customer-supplied bonding diagram
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If you wish to supply your own bonding diagram, select "Customer" in
the "Bonding Diagram Supplier" field of your NEW_PROJECT, FABRICATION,
or UPDATE request. Send your initial bonding diagram to MOSIS no less
than two business-days before your target run is scheduled to
begin. For more information, see
Telling MOSIS Which Package to
Use.
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1.5 Use of customer-supplied packages
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If you wish to supply your own packages, include this request in the
SPECIAL_HANDLING parameter in your NEW_PROJECT or FABRICATION request,
and send your packages to MOSIS no less than two business-days before
the run is scheduled to close
For more information, see
Customer-Supplied
Packages.
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1.6 Special orientation of my circuit in the package
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You can specify the orientation of your design in the package cavity
by supplying a bonding diagram that clearly indicates
how the design should be oriented in the package cavity
during assembly.
For more information see
Design Orientation and
Use of Customer-Supplied Bonding Diagram.
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1.7 Sealing of package lids
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If you wish to have the lids on your ceramic packages sealed,
include this request
in the SPECIAL_HANDLING
parameter in your NEW_PROJECT or FABRICATION request
Note that lids for parts in plastic packages must
always be sealed. The following lid
options are available for ceramic packages:
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Taped lids
(the MOSIS default for ceramic packages)
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Hermetically sealed lids
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Semi-epoxy sealed lids
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Full-epoxy sealed lids
For more information, see
Lids (Taping or Sealing).
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1.8 Downbond to the package cavity
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If you wish to request a downbond in your packages, include this
request in
SPECIAL_HANDLING
parameter when you send your NEW_PROJECT or FABRICATION request to
MOSIS.
For more information, see
Downbond.
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1.9 Bonding only SOME of my pads
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Projects designed using MOSIS SCMOS rules can use an an optional layer
(called XP in CIF and numbered 26 in GDSII) to define which pads are
to be bonded and which are not. This layer is valid ONLY in MOSIS
SCMOS rules. For more information, see
XP Layer.
For projects designed using vendor rules, please provide a bonding
diagram. For more information, see
Bonding
Diagrams.
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1.10 MOSIS standard frames
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Standard frames have been phased out by MOSIS.
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1.11 A specific or minimum die size
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To request a special or minimum die size to facilitate packaging (or
for other reasons) see
die size.
2.0 Can I order the following from MOSIS?
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2.1 Can I order assembly in ceramic packages?
Assembly of parts in ceramic packages is the default for circuits
fabricated by MOSIS. See
MOSIS Ceramic Packaging Options.
2.2 Can I order assembly in plastic packages?
Assembly of parts in plastic packages is available from
MOSIS. See
MOSIS Plastic Packaging Options
2.3 Can I order packages and lids (materials only)?
It is sometimes possible to purchase small quantities of packages and
lids from MOSIS, but packaging materials are not a standard MOSIS
product, and the part you need might not always be available.
If you wish to purchase
packages or lids from MOSIS, send a Request for Quote that includes
the manufacturer, part number and quantity required to
support@mosis.com.
Instead of ordering through MOSIS,
you may wish to order materials directly
from one of the suppliers MOSIS works with:
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Coors Technical Ceramics: 800-821-6110
Kyocera America: 858-576-2600
Spectrum Semiconductor: 408-435-5555
2.4 Can I order assembly of parts not fabricated by MOSIS?
Assembly of parts not fabricated by MOSIS is not a service currently
offered by MOSIS. Some packaging vendors will assemble small
quantities of parts, but there is often a minumum charge, which could
be as high as several hundred dollars. Here are some assembly vendors
MOSIS has worked with:
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I2A Technologies (formerly IPAC): 408-321-3600
Corwil Technology: 408-321-6404
Promex Industries, Inc. 408-496-0222
2.5 Can I order printed circuit boards?
MOSIS does not offer printed circuit board fabrication because it is
more efficient and cost effective
for designers to contract directly with board manufacturers.
We can, however, give you the name of some
suppliers we have worked with:
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American Technology Services
1312 East 29th Street, Signal Hill CA 90806
Phone: 562-426-0521 | Fax: 562-426-2560
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Dynamic Details, Inc.
1220 N. Simon Circle, Anaheim, CA 92806
Phone: 714-688-7300
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Multilayer Technology Inc (Multek)
16 Hammond, Irvine, CA 92718
Phone: 949-951-3388 | Fax: 949-951-5431
2.6 Can I order MCM devices
MOSIS does not currently offer MCM fabrication,
but that may change in the future. If you would like MOSIS
to offer this service, please let us know by sending
email to
support@mosis.com.
2.7 Can I order flip-chip (bump) assembly
MOSIS offers flip-chip bumping. Since bumping requirements vary,
please contact the MOSIS Packaging Manager at
support@mosis.com with your
requirements.
2.8 Can I order testing services
Functional testing (digital) is available from MOSIS, and
quotes are provided on a case-by-case basis. Send
quote requests to:
mosis@mosis.com.
3.0 How does MOSIS select a package for my parts?
Parts packaged by MOSIS must fit within the cavity of a standard
MOSIS or customer-supplied package and must meet normal wire bonding
requirements. Considerations include the following:
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Project size
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MOSIS overhead
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Buffer (project edge to scribe lane spacing)
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Package cavity
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Die edge to package cavity spacing
For more information, see
Die Size.
4. Can I tell MOSIS which package to use?
You can dictate the package type and pad-to-pin assignments by
providing MOSIS with a bonding diagram. Bonding diagram templates
for MOSIS ceramic packages are available on the MOSIS web site (see
MOSIS Ceramic Packaging Options).
Note that when you prepare the bonding diagram, you must draw
your die to scale with respect to the package cavity.
If you wish to supply your own bonding diagram, select "Customer" in
the "Bonding Diagram Supplier" field of your NEW_PROJECT, FABRICATION,
or UPDATE request.
Initial bonding diagrams are due at MOSIS no less than two
business-days before your target run is scheduled to close. They must
be labeled with (A) the MOSIS Design ID (like 12345), (B) the project
name, and (C) the MOSIS account number, and sent to:
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MOSIS Packaging Manager
Fax: 310-823-5624
5. Can I receive parts sooner if I don't have them packaged?
Unfortunately, the answer is no, because we receive packaged and
unpackaged parts from our assembly vendor at the same time.
6. Can I receive parts sooner if I pay more money?
If you wish to pay additional money to expedite your order, you can do
one of two things: (A) pay $20 extra for overnight delivery, or
(B) pay thousands of dollars extra to expedite wafer processing
(option B is not always available).
For more information, see
Submitting Purchase Orders to MOSIS.
7. Can I save money by ordering unpackaged parts?
Yes, because fabrication and packaging are priced separately.
8. What are TinyChips?
The term "TinyChip" is used to refer to the small chip size MOSIS will
fabricate free for MEP Instructional accounts under the
MOSIS Educational Program.
Submissions from commercial accounts are not calculated in TinyChip
units.
TinyChip sizes are:
9. Are there any packaging restrictions for TinyChips?
TinyChip designs fabricated under MEP Instructional accounts have
certain packaging restrictions that do not apply to designs charged to
commercial accounts.
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Package lids cannot be sealed for educational designs.
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MEP Instructional designs must fit into a
MOSIS TinyChip and must either:
10. What layout does MOSIS recommend for bonding pads?
The minimum recomended pad layout for wire bonding is a 90 x 90 micron
(3.5 x 3.5 mils) glass cut box over a 100 x 100 (3.9 x 3.9 mils)
micron top metal box. For more information, see
Bonding Pad Layout and Placement.
11. Does using a guard ring affect pad spacing?
Use of a guard ring does not effect pad spacing. Rather than discuss
pad spacing we prefer to discuss pad size and pitch. Pad size/pitch
is a packaging issue not a processing one. Our general recommendation
is that pads are 100 µm x 100 µm with a pitch of 170
(allows for pad edge to pad edge spacing of 70 µm). Smaller
pads and tighter pitch is possible but not without considering the
exact location of the package cavity pins, angle of wire to the pins
and length of the wires.
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