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MOSIS Fabrication Processes
Technology descriptions, fabrication schedules, and vendor document
access procedures for the AMIS, austriamicrosystems, IBM, and TSMC
fabrication processes available through MOSIS.
AMIS Fabrication Processes
The AMIS processes available through MOSIS include 1.5 µm CMOS,
0.7 µm high voltage CMOS, 0.5 µm CMOS, and
0.35 µm high voltage CMOS.
austriamicrosystems Fabrication Processes
Processes offered by MOSIS through austriamicrosystems include
0.35 µm CMOS, high voltage CMOS, and SiGe BiCMOS.
IBM Fabrication Processes
The IBM fabrication processes available through MOSIS
range from 65 nanometer to 0.25 µm in CMOS, and from
0.13 µm to 0.50 µm in SiGe BiCMOS.
TSMC Fabrication Processes
The TSMC logic and mixed-mode fabrication processes available
through MOSIS include 0.35 µm CMOS, 0.25 µm CMOS,
0.18 µm CMOS, and 0.13 µm CMOS.
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For more information about MOSIS fabrication processes, please contact
support@mosis.com.
Related Links
MOSIS Fabrication Schedule
Customer Support
MOSIS Products
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