07-JAN-2009 00:24 Page 1 of 590
MEP Projects by University
Organization: Alabama A&M University
Technology: AMI_ABN
Project ID: 77093 Project Area: 4.8
Description: Test Structures.
Project ID: 78731 Project Area: 4.8
Description: Dear Sir or Madam:
We are requesting to fabricate a tiny IC chip (2.2 mm by 2.2 mm) using the AMI 1.5 um ABN technology for our senior research project for our senior students. The IC chip is a CMOS-based IC circuit for a photodetector interface circuit. We
are expecting that it can be fabricated in January so that our senior students can characterize the circuit in the following couple of weeks before their graduation. We appreciate your kind hlep very much.


07-JAN-2009 00:24 Page 2 of 590
MEP Projects by University
Organization: Alfred University
Technology: SCN3M
Project ID: 63017 Project Area: 2.2
Description: frame test 1
Project ID: 64685 Project Area: 2.2
Description: RETINA2002
Project ID: 69894 Project Area: 2.2
Description: retina2004
Project ID: 78068 Project Area: 2.3
Description: AnalogM35S07
Project ID: 78420 Project Area: 2.3
Description: MeridithSept07
Technology: SCN3ME_SUBM
Project ID: 68776 Project Area: 2.3
Description: analog_09
Project ID: 68807 Project Area: 2.3
Description: analog_10
Project ID: 70558 Project Area: 2.3
Description: ANALOG11


07-JAN-2009 00:24 Page 3 of 590
MEP Projects by University
Organization: Alfred University
Technology: SCNA
Project ID: 62633 Project Area: 4.8
Description: misc analog parts
Project ID: 63224 Project Area: 4.8
Description: ANALOG4_03
Project ID: 64978 Project Area: 4.8
Description: analog5
Project ID: 65661 Project Area: 4.8
Description: analog6_09
Project ID: 67224 Project Area: 4.8
Description: analog7_03
Project ID: 77993 Project Area: 4.9
Description: AnalogS07


07-JAN-2009 00:24 Page 4 of 590
MEP Projects by University
Organization: Arizona State University
Technology: IBM_7RF
Project ID: 76066 Project Area: 14.6
Description: ScalablePipelineADC
Technology: IBM_8RF
Project ID: 78499 Project Area: 11.4
Description: Continuous-Time Sigma-Delta


07-JAN-2009 00:24 Page 5 of 590
MEP Projects by University
Organization: Arizona State University
Technology: SCN3ME_SUBM
Project ID: 66380 Project Area: 9
Description: 3rd order cascaded sigma-delta modulator
Project ID: 67480 Project Area: 2.3
Description: subnoise
Project ID: 67485 Project Area: 9
Description: 8_2 fpa
Project ID: 67521 Project Area: 8.4
Description: microfluidic
Project ID: 67821 Project Area: 2.2
Description: photodetector
Project ID: 70001 Project Area: 2.3
Description: NIC_TOP
Project ID: 70003 Project Area: 2.2
Description: NIC_DIE
Project ID: 71090 Project Area: 2.3
Description: uwb_pg_asu_v10
Project ID: 71100 Project Area: 2.3
Description: uwb_pg_asu_v10_pack
Project ID: 71279 Project Area: 2.3
Description: uwb_pg_open_soic28
Project ID: 72168 Project Area: 2.3
Description: log_lin_cis_v01
Project ID: 72179 Project Area: 2.3
Description: pdw_array_v01
Project ID: 72462 Project Area: 2.3
Description: uwb_pg_asu_v20
Project ID: 73904 Project Area: 7.7
Description: successive ADC
Project ID: 74170 Project Area: 2.3
Description: uwb_pg_v02


07-JAN-2009 00:24 Page 6 of 590
MEP Projects by University
Organization: Arizona State University
Technology: SCN3ME_SUBM
Project ID: 74548 Project Area: 2.3
Description: uwb_pg_v021
Project ID: 75064 Project Area: 2.3
Description: uwb_pg_v012
Project ID: 75287 Project Area: 2.3
Description: uwb_pg_v022_Tx
Project ID: 75314 Project Area: 8.6
Description: FPCIS
Project ID: 75321 Project Area: 2.3
Description: uwb_pg_v022_Tx2
Project ID: 75445 Project Area: 8.6
Description: FPCIS2
Project ID: 75446 Project Area: 2.3
Description: SIDEL01
Project ID: 75457 Project Area: 2.3
Description: uwb_pg_v012_tx
Project ID: 75478 Project Area: 2.3
Description: pg_v021_tx
Project ID: 75812 Project Area: 2.3
Description: overall_chip
Project ID: 75953 Project Area: 8.6
Description: parallelRegulator
Project ID: 76467 Project Area: 2.3
Description: SRCISTESTPIXEL
Project ID: 76711 Project Area: 8.6
Description: SRCIS4X4
Project ID: 77179 Project Area: 8.6
Description: STSRCIS4X4
Project ID: 77193 Project Area: 2.3
Description: STTESTPIXEL


07-JAN-2009 00:24 Page 7 of 590
MEP Projects by University
Organization: Arizona State University
Technology: SCN3ME_SUBM
Project ID: 77362 Project Area: 2.3
Description: STTESTPIXELREG
Project ID: 77363 Project Area: 2.3
Description: STTESTPIXEL2
Project ID: 77364 Project Area: 2.3
Description: STTESTPIXELREG2
Project ID: 77366 Project Area: 2.3
Description: STPIXEL_SAMPLING
Project ID: 77367 Project Area: 2.3
Description: STPIXELREG_SAMPLING
Project ID: 77368 Project Area: 2.3
Description: STPIXEL_SAMPLING2
Project ID: 77369 Project Area: 2.3
Description: STPIXELREG_SAMPLING2
Project ID: 77525 Project Area: 8.6
Description: FINAL
Project ID: 77535 Project Area: 8.6
Description: final2
Project ID: 78259 Project Area: 8.6
Description: final2
Project ID: 78260 Project Area: 8.6
Description: final2b
Project ID: 78767 Project Area: 8.6
Description: Radix-3 SAR ADC
Project ID: 79075 Project Area: 8.6
Description: final3
Project ID: 80293 Project Area: 8.6
Description: screg


07-JAN-2009 00:24 Page 8 of 590
MEP Projects by University
Organization: Arizona State University
Technology: SCNE
Project ID: 65393 Project Area: 4.8
Description: Group3_edu2002
Project ID: 65395 Project Area: 4.8
Description: Testchip_edu02
Technology: TSMC18
Project ID: 66887 Project Area: 6.3
Description: 64*64 cmos image sensors
Project ID: 69165 Project Area: 1.5
Description: UWB_LNA_ASU
Project ID: 72661 Project Area: 3.2
Description: A Current-Steering FIR Digital-to-Analog Converter
Technology: TSMC25
Project ID: 72946 Project Area: 20.7
Description: In this project a new high-speed high-resolution digital?to-analog converter (DAC) is proposed with up-conversion mixer embedded in the DAC circuitry. A current steering DAC is used to convert sigma delta modulated digital waveform at IF to
analog RF signal. The objective of this design is to perform the analog to digital conversion and mixing in one block and benefit from high tolerance of this method to jitter and switching distortion. Another feature of this design is an
embedded filtering mechanism inside the DAC circuit. The input digital data is fed to a finite impulse response (FIR) filter that performs serial to parallel conversion and provide switching waveform for the current steering DAC?s current
units. The FIR filter provides Bandpass filtering at RF and also relaxes the matching requirements in the DAC unit current elements, which is a very strict requirement in conventional DAC?s. The system will have improved SNR, SFDR and power
consumption vs. conventional designs.
Project ID: 73317 Project Area: 9
Description: IC-ULP-PH/PLL
Project ID: 73318 Project Area: 6.1
Description: IC-TR
Project ID: 73319 Project Area: 8.7
Description: IC-PM


07-JAN-2009 00:24 Page 9 of 590
MEP Projects by University
Organization: Assiut University
Technology: SCNE
Project ID: 64823 Project Area: 3.8
Description: This project is student project and has been approved by MOSIS Educational Program (MEP).The account name :
ACCOUNT name : 3180-MEP-INS/ASSIUTU-EE


07-JAN-2009 00:24 Page 10 of 590
MEP Projects by University
Organization: Auburn University
Technology: IBM_5AM
Project ID: 72875 Project Area: 2.7
Description: LNA,VCO
Technology: IBM_5HP
Project ID: 71548 Project Area: 2.4
Description: Transversal Equalizer for compensating Fiber Dispersion.


07-JAN-2009 00:24 Page 11 of 590
MEP Projects by University
Organization: Auburn University
Technology: SCN3ME_SUBM
Project ID: 65332 Project Area: 2.3
Description: two ALUs for delay testing.
Project ID: 65334 Project Area: 2.3
Description: EE7970 ALU Chip Design for delay testing. There are two ALU units on the chip, good one (top) and delayed one (bottom).
HADD1 is added to output Cn+4Bar and BUFFER8X is added to output X.
Project ID: 65338 Project Area: 2.3
Description: ee7970 ALU design
Project ID: 65339 Project Area: 2.3
Description: This is Qi Feng's project. The chip is consist of two 4-bit ALU. The one is well designed, another one is with added delay faults.
Project ID: 65343 Project Area: 2.3
Description: Name : Karthik Narayanan
Description of the design:
This design is a dual 4-bit Registered-ALU intended to study delay faults due to loading. The chip has two identical ALU units with one of them loaded on some non-critical paths.
Project ID: 65345 Project Area: 2.3
Description: Elec7970 project,Cai Wang, Auburn University
Project ID: 65353 Project Area: 2.3
Description: Liping Guo, Auburn University
Dual ALU that includes a good ALU and a faulty ALU
Project ID: 65357 Project Area: 2.3
Description: KEZHOU WANG AUBURN UNIVERSITY
ALU PROJECT FOR ELEC7970 CLASS
Project ID: 65358 Project Area: 2.3
Description: Jinghong Ma, Dual ALU.
Project ID: 65359 Project Area: 2.3
Description: TWO ALU TO COMPARE THE PERFORMANCE
Project ID: 65363 Project Area: 2.3
Description: RAMKUMAR KRITHIVASAN,
In this project we have designed a chip that contains a 4-bit ALU and a its replica with loading in 2 internal signal paths. The the delay variations between the good and loaded ALUs are going to be studied, putting to test a VLSI testing
algorithm for detecting this intentionally introduced defect.


07-JAN-2009 00:24 Page 12 of 590
MEP Projects by University
Organization: Auburn University
Technology: SCN3ME_SUBM
Project ID: 65366 Project Area: 2.3
Description: Brad Donaldsons ELEC7970 Project / 2 ALU's on Chips
Project ID: 65442 Project Area: 2.3
Description: EE7970_YIJING
Project ID: 65461 Project Area: 2.3
Description: this is the a chip designed for elec7970, by Jun Huang
Project ID: 65464 Project Area: 2.3
Description: This is to be used for delay testing experiments. 2 identical alus are created, one good and one with deliberate faults.
Project ID: 65487 Project Area: 2.3
Description: Bill Dillard - Control chip for switching paralleled IGBTs and MOSFETs.
Organization: Benemerita Univeridad Autonoma de Puebla
Technology: SCN3ME_SUBM
Project ID: 77982 Project Area: 5.3
Description: MICROSENSOR SYSTEM AND TEST DEVICES STRUCTURES AND CIRCUITS
Technology: SCNA
Project ID: 77472 Project Area: 4.6
Description: CMOS COMPATIBLE MICROELECTRODE ARRAY AND READ-OUT CIRCUIT


07-JAN-2009 00:24 Page 13 of 590
MEP Projects by University
Organization: Boise State University
Technology: SCN3ME_SUBM
Project ID: 64596 Project Area: 2.3
Description: CMOS filter
Project ID: 64633 Project Area: 2.1
Description: analog test structures
Project ID: 64700 Project Area: 2.1
Description: Bill's chip with test structures
Project ID: 67253 Project Area: 2.2
Description: Roger Porter's various flash cells
Project ID: 70590 Project Area: 2.2
Description: SENSING CIRCUITS
Project ID: 71299 Project Area: 2.2
Description: BSU Schottky Diode
Project ID: 71300 Project Area: 2.2
Description: BSU Schottky Diode
Project ID: 71301 Project Area: 2.2
Description: BSU Schottky Diode
Project ID: 71302 Project Area: 2.2
Description: BSU Schottky Diode
Project ID: 71660 Project Area: 2.2
Description: Schottky diodes
Project ID: 71668 Project Area: 1.9
Description: Input buffers
Project ID: 71682 Project Area: 2.2
Description: Sensing ckt
Project ID: 72692 Project Area: 1.9
Description: Input buffers
Project ID: 76724 Project Area: 1.9
Description: test structures
Project ID: 77167 Project Area: 1.3
Description: test structures


07-JAN-2009 00:24 Page 14 of 590
MEP Projects by University
Organization: Boise State University
Technology: SCN3ME_SUBM
Project ID: 77425 Project Area: 1.9
Description: test structures
Project ID: 78231 Project Area: 1.9
Description: test structures
Project ID: 78232 Project Area: 1.9
Description: test structures
Project ID: 78453 Project Area: 1.9
Description: test structures
Project ID: 78455 Project Area: 3.7
Description: test structures
Project ID: 78824 Project Area: 1.9
Description: Thesis design project at Boise State University. Low voltage temperature sensor.
Project ID: 79120 Project Area: 1.9
Description: test structures
Project ID: 79140 Project Area: 8.7
Description: test structures
Project ID: 79358 Project Area: 1.5
Description: ADC for and Image Sensor using Delta Sigma Modulation
Project ID: 79812 Project Area: 8.5
Description: Chip contains 18 variations of photo-diodes, sized 40um up to
120um on a side of active area, half p-sub to n-well, half of them p-sub to
n+ active. Each photo-diode is duplicated 3 times for a total of 54 diodes.
Each diode has its own transconductance amplifier connected to it.
Project ID: 79823 Project Area: 1.9
Description: S08 student project1
Project ID: 79824 Project Area: 1.9
Description: S08 student project2
Project ID: 79833 Project Area: 2.1
Description: DSM test structures


07-JAN-2009 00:24 Page 15 of 590
MEP Projects by University
Organization: Boise State University
Technology: SCN3ME_SUBM
Project ID: 80121 Project Area: 2.2
Description: Photodiodes which will undergo test for current producing capability. On chip is a delta-sigma sense amp for measuring current, and a 16:1 Mux to pick which diode is under test.
Project ID: 80512 Project Area: 1.9
Description: Flash Test Structures