MOSIS 2.0 USC Viterbi Information Sciences Institute CA Dreams

Your Gateway to Rapid Prototyping

Don't miss our upcoming MPW tapeout dates!
Foundry Service Technology Node Tapeout Date
TSMC 12nm 4/8/2026
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Nanofab Prototyping

Rapid prototyping and process development capability through access to seven university nanofabrication facilities and other experimental prototyping facilities within the Southern California area and throughout the nation.

MPW Services

Supporting both silicon CMOS and advanced compound semiconductor technologies with seamless access to a wide array of commercial silicon MPW services from leading large, medium, and small-volume foundries.

IC Design

Providing comprehensive chip design services that simplify and streamline the development process, enabling customers to bring their innovative ideas from concept to silicon.

Upcoming Events

MOSIS 2.0 Developer Workshop at GOMACTech 2026

Hilton Garden Inn New Orleans Convention Center

March 103:30 – 5:30 pm CST1001 S. Peters StreetNew Orleans, LA

More event details coming soon.

Don’t miss the opportunity to engage with MOSIS 2.0 and accelerate your semiconductor circuit design and prototyping from concept to tape-out!

Fill Out Our Interest Form

MOSIS 2.0 Feed

MOSIS 2.0
MOSIS 2.0
March 3
Don’t miss the MOSIS 2.0 Developer Workshop at GOMACTech 2026 in New Orleans!

πŸ“… March 10 | 3:30–5:30 PM CST
πŸ“ Hilton Garden Inn, New Orleans Convention Center

Discover how MOSIS 2.0 can be your one-stop shop for access to MPW runs, research fabs, and expert design support.

πŸ‘‰ Register your interest now:οΏ½ https://lnkd.in/gRVCw88a

Also find us at booth 412 at the GOMACTech Exhibition.
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MOSIS 2.0
MOSIS 2.0
February 27
Our MOSIS 2.0 team is hosting a Developer Workshop at GOMACTech 2026 in New Orleans.

πŸ“ Hilton Garden Inn – New Orleans Convention Center
πŸ“… March 10 | 3:30 – 5:30 PM CST

This workshop is designed for semiconductor and microelectronics developers looking to accelerate circuit design and prototyping β€” from concept to tape-out.

Engage directly with the MOSIS 2.0 team and explore how to streamline your development cycle and bring advanced microelectronic systems to life faster.

Seats are limited.

πŸ‘‰ Express your interest here: https://lnkd.in/gRVCw88a

You can also chat with us at booth 412 at the GOMACHTech exhibition. We look forward to meeting you!

Β 
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MOSIS 2.0
MOSIS 2.0
January 16
We're Hiring! EDA Infrastructure Engineer – Join the MOSIS 2.0 Team at USC.

Are you passionate about advancing semiconductor design infrastructure? We have an exciting opening on the MOSIS 2.0 PIES Team at USC/ISI.

πŸ“ Los Angeles, CA (On-site at USC University Park Campus)
πŸ’Ό Full-Time | Salary: $156,918 – $180,000

What You'll Do:
πŸ”Ή Maintain and optimize multi-vendor EDA tool flows for digital design
πŸ”Ή Manage cloud platforms for EDA tools and IP repositories
πŸ”Ή Support users across the MOSIS 2.0 hub and partner ecosystem

You're a Great Fit If You Have:
βœ” Experience with EDA tools from vendors like Ansys, Cadence, Siemens, Synopsys
βœ” Cloud platform experience for EDA deployment
βœ” Master's degree in EE or related field
βœ” U.S. citizenship or permanent residency (ITAR/EAR required)

Apply now: https://lnkd.in/gVCEBSs7

Know someone perfect for this? Share away!
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EDA Infrastructure Engineer at USC
EDA Infrastructure Engineer at USC usccareers.usc.edu
MOSIS 2.0
MOSIS 2.0
December 9
Come visit the MOSIS 2.0 booth at the International Electron Devices Ltd. Meeting (IEDM) in San Francisco, CA to explore our latest capabilities and project support services.

Our booth is #11 and we will be open Tuesday 8-5 PST and Wednesday 8-11 PST.

We hope to see you there!
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MOSIS 2.0
MOSIS 2.0
December 1
Read about how we work with USC Information Sciences Institute on Bridging The Valley of Death!
USC Information Sciences Institute
From Concept to Silicon: How We're Democratizing Semiconductor Innovation

Two years into California DREAMS, USC Information Sciences Institute's Computational Systems Division is tackling one of the biggest challenges in chip development: the "valley of death" between brilliant ideas and working prototypes.

The problem? Modern semiconductor designs require expensive IP licenses, complex toolchains, and expertise in peripheral technologies that pull innovators away from their breakthrough ideas. A single chip can demand hundreds of thousands of dollars in licensing costs alone.

Our solution combines three strategic approaches:
Rapid Design Generation β†’ Platform SoC generators that can produce complete architectures in hours instead of months, enabling parallel design space exploration

Comprehensive IP Repository β†’ Silicon-verified processors, accelerators, and specialized cores including our DARPA-developed high-speed DSP and homomorphic encryption IP

Accelerated Prototyping β†’ FPGA-based platforms (MAPP) that dramatically reduce pre- and post-fabrication testing complexity and cost

What sets us apart: we're a DMEA-accredited trusted IC supplier with CMMC accreditation, combining university research agility with the security credentials and infrastructure to support sensitive government projects.

The result? Research teams can focus on their core innovations while we handle the increasingly complex infrastructure demands. We're restoring semiconductor development to its innovation-focused roots.

Read the full story about how MOSIS 2.0 is transforming the semiconductor development ecosystem β†’ https://lnkd.in/gKmDm8D4
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Engaging with MOSIS 2.0

MOSIS 2.0 is the central storefront and gateway to access cutting-edge prototyping services, targeting advanced RF, 5G/6G, and EW applications.

The Prototype Integration and Engineering Service (PIES) Team is at the core of MOSIS 2.0 - a dedicated fab-knowledgeable engineering group that supports designers to accelerate their innovations to solutions.

  • Internal "Pipe Cleaner" Projects: PIES-led prototyping to optimize workflows, methods, and infrastructure
  • Externally Funded Prototyping: Rapid process and chip development for defense/commercial partners
  • Process Characterization & Analytics: Metrics, statistical analysis, and modeling with PDF Solutions
  • Small-Volume Fabrication Services: Flexible access to design/development via Fabublox on MOSIS Storefront
  • MPW & EDA Services: Efficient prototyping through DoW/Commercial foundries with MPW and design tools.

We invite innovators, researchers, and industry partners to engage with MOSIS 2.0-and join us in advancing next-generation microelectronics.

MOSIS Prototype Integration and Engineering Service
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Our Technologies

Digital CMOS

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Photonics

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Meet the Team

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